PRODUCT SEARCH: SPEAKERS
Max Outer Dimension(s)
Height
Nominal Input
Termination Type
Resonant Frequency
Form Factor
IP Capable
Enter <, > or ‐ character to filter by maxes, mins or ranges.
(e.g. <20, >10 or 10-20)
Part Number
Max Outer Dimension(s)
Height
Nominal Input
SPL at 10 cm Nominal Input
Termination Type
Resonant Frequency
Form Factor
IP Capable
12.0∅ mm
6.7 mm
0.005 W
97 dB, IEC-318
Solder Point
1200 Hz
Planar Magnetic
12.0 × 6.0 mm
2.8 mm
0.50 W
84 dB
Spring
1100 Hz
Mobile
IPX7 Front Face
12.0 × 6.0 mm
2.0 mm
0.02 W
98.5 dB, IEC-318
Spring
400 Hz
Receiver
12.0 × 6.0 mm
2.2 mm
0.02 W
123 dB, IEC-318
Spring
600 Hz
Receiver
IP67 Front Face
13.0∅ mm
2.8 mm
0.20 W
88 dB
Solder Point
1100 Hz
Round
13.0∅ mm
3.0 mm
0.50 W
94 dB
Wire Leaded
1050 Hz
Round
IP67 Front Face
13.0 × 13.0 mm
4.1 mm
0.70 W
90 dB
Surface Mount
850 Hz
Square
13.0∅ mm
3.0 mm
0.50 W
94 dB
Solder Point
1050 Hz
Round
13.5 × 6.5 mm
3.0 mm
0.80 W
88.5 dB
Solder Point
900 Hz
Mobile
IP67
14.2 × 9.6 mm
2.9 mm
0.30 W
82 dB
Spring
800 Hz
Mobile
14.6∅ mm
4.9 mm
0.005 W
114 dB, IEC-318
Solder Point
1000 Hz
Planar Magnetic
15.0 × 11.0 mm
2.5 mm
0.80 W
93 dB
Spring
850 Hz
Mobile
15.0 × 11.0 mm
3.5 mm
1.00 W
97 dB
Solder Point
950 Hz
Mobile
IP67 Front Face
15.0 × 11.0 mm
2.5 mm
1.00 W
93 dB
Spring
900 Hz
Mobile
15.0 × 11.0 mm
3.5 mm
1.00 W
97 dB
Solder Point
950 Hz
Mobile
15.0 × 11.0 mm
3.0 mm
1.00 W
94 dB
Solder Point
850 Hz
Mobile
15.0 × 7.0 mm
2.0 mm
1.00 W
89 dB
Solder Point
2800 Hz
Mobile
15.0 × 11.0 mm
4.0 mm
1.00 W
99 dB
Solder Point
1000 Hz
Mobile
IPX7 Front Face
15.0 × 15.0 mm
4.0 mm
0.80 W
92 dB
Surface Mount
800 Hz
Square
15.0 × 11.0 mm
2.5 mm
0.50 W
87 dB
Spring
950 Hz
Mobile
IPX8
15.0 × 11.0 mm
3.5 mm
1.00 W
99 dB
Spring
950 Hz
Mobile
IP67 Front Face
15.0 × 11.0 mm
3.5 mm
0.70 W
97.5 dB
Spring
600 Hz
Mobile
15.0 × 8.0 mm
2.5 mm
0.66 W
88.5 dB
Solder Point
950 Hz
Oval
15.0∅ mm
3.4 mm
0.50 W
95 dB
Solder Point
850 Hz
Round
15.0 × 11.0 mm
3.5 mm
0.50 W
89 dB
Solder Point
600 Hz
Mobile
15.0 × 8.0 mm
3.0 mm
0.80 W
95 dB
Solder Point
1000 Hz
Mobile
16.0 × 9.0 mm
2.7 mm
0.70 W
92 dB
Solder Point
850 Hz
Mobile
IPX7 Front Face
16.0∅ mm
3.2 mm
0.30 W
92 dB
Spring
780 Hz
Round
16.0 × 15.0 mm
4.3 mm
0.30 W
89 dB
Surface Mount
950 Hz
Square
16.0 × 9.0 mm
3.0 mm
0.70 W
91 dB
Wire Leaded
1300 Hz
Mobile
16.0 × 9.0 mm
3.0 mm
1.00 W
95 dB
Spring
950 Hz
Mobile
IPX7
16.0 × 9.0 mm
3.0 mm
0.94 W
91 dB
Solder Point
850 Hz
Mobile
16.0 × 9.0 mm
3.0 mm
0.94 W
91 dB
Spring
850 Hz
Mobile
16.0∅ mm
3.2 mm
0.30 W
92 dB
Solder Point
780 Hz
Round
17.0 × 12.0 mm
2.3 mm
0.60 W
92.8 dB
Solder Point
800 Hz
Mobile
17.0 × 12.0 mm
3.3 mm
1.00 W
99 dB
Solder Point
1000 Hz
Mobile
IP67 Front Face
17.0 × 12.0 mm
2.5 mm
1.00 W
95 dB
Solder Point
870 Hz
Mobile
IPX7 Front Face Capable*
18.0 × 13.0 mm
2.5 mm
1.00 W
96 dB
Solder Point
850 Hz
Mobile
18.0∅ mm
5.2 mm
2.00 W
96 dB
Solder Point
500 Hz
Round
18.0 × 16.0 mm
3.7 mm
2.00 W
104 dB
Solder Point
1100 Hz
Mobile
IP67 Front Face
18.0∅ mm
5.0 mm
1.00 W
95 dB
Wire Leaded
500 Hz
Round
18.0 × 18.0 mm
5.1 mm
1.00 W
97 dB
Surface Mount
1000 Hz
Square
18.0 × 13.0 mm
4.5 mm
1.00 W
100 dB
Solder Point
950 Hz
Mobile
IP67 Front Face
18.0 × 13.0 mm
4.5 mm
1.00 W
100 dB
Spring
950 Hz
Mobile
18.0∅ mm
5.7 mm
1.00 W
95 dB
Solder Point
500 Hz
Round
18.0∅ mm
3.3 mm
0.25 W
90 dB
Solder Point
1000 Hz
Round
19.0 × 14.0 mm
3.7 mm
2.00 W
105 dB
Wire Leaded
1000 Hz
Mobile
20.0 × 12.0 mm
3.7 mm
2.00 W
104 dB
Solder Point
1050 Hz
Mobile
IPX8 Front Face
20.0∅ mm
5.3 mm
1.50 W
94.8 dB
Solder Point
700 Hz
Round
20.0 × 16.0 mm
2.4 mm
1.00 W
94.5 dB
Solder Point
630 Hz
Mobile
20.0 × 20.0 mm
4.5 mm
0.80 W
99 dB
Surface Mount
850 Hz
Square
20.0∅ mm
4.1 mm
0.50 W
91 dB
Solder Point
550 Hz
Round
20.0∅ mm
3.0 mm
0.50 W
93 dB
Solder Point
500 Hz
Round
20.0 × 8.0 mm
3.1 mm
0.10 W
79 dB
Solder Point
270 Hz
Mobile
Count: 54

CHALLENGE ELECTRONICS

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  • Deer Park, NY 11729
  • ph: 800-722-8197
  • fax: 631-667-5484

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